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Keywords: Multi‐chip module
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (1): 35–39.
Published: 01 April 2000
...H. Kanbach; J. Wilde; F. Kriebel; E. Meusel A new concept of 3D‐electronic packaging is presented: Si‐on‐Si multi‐chip module flip‐chip technology with arrays of fine etched and filled vertical electrical interconnections (vias). Arrays of vias with a high number of interconnections, and not only...
