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Keywords: Nucleation
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (1): 24–32.
Published: 16 January 2020
... to electroplating, the copper substrates were cleaned with dilute H2SO4 and washed with running water. Figure 1 The pulse plating set-up used in the study Nucleation Morphology Tin Galvanostatic measurements Pulse electrodeposition Pulse plating Electrodeposition Sn-Cu...
