..., optimization based deep learning model has been proposed by using 2D signal processing methods. Design/methodology/approach An optimization-based deep learning model is proposed by using image-processing techniques to detect solder paste defects on PCBs with high performance at an early stage...

... © Emerald Group Publishing Limited 2015 Microstructure Pb-free Optimization Lanthanum SAC alloys Tensile testing Excellent thermal and mechanical properties are desired in any solder joint. Such good properties were well-established for tin–lead (Sn-Pb) solders until...

... optimisation at the early product development stage. The design methodology is used to identify the optimal design of lead‐free (Sn3.9Ag0.6Cu) solder joints in fine‐pitch copper column bumped flip‐chip electronic packages. Design/methodology/approach The design methodology is generic and comprises...

... framework is capable of performing design optimisation procedures in an entirely automated and systematic manner. © MCB UP Limited 2002 Optimization Flip chip Underfill Reliability With respect to coefficient of thermal expansion CTE, the organic composite materials (FR‐4...

...Gary K.K. Poon; D.J. Williams The objectives of this research are to model the screening process with planned experiments and to identify the optimal setting of the process parameters so as to minimize the printing defects. The percentage volume matching (PVM) and defects per unit (DPU) are the two...