Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-2 of 2
Keywords: Organometallic compounds
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 18–26.
Published: 01 April 2006
... to the Cu metallization was (Cu1−y,Niy)6Sn5, for which the value of y remained around 0.21. Solders Metallurgy Organometallic compounds Electrical connections Electronic packaging of electronic products provides the medium...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (2): 3–9.
Published: 01 June 2005
... the solders (Figure 10) for plasma‐reflowed joints with the thick UBM compared to those with thin UBM (Figures 5 and 7). © Emerald Group Publishing Limited 2005 Soldering Joining processes Strength of materials Organometallic compounds Environmental concerns have led to considerable...
