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Keywords: Oxygen followed by argon plasma treatments
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Journal Articles
Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (4): 129–136.
Published: 07 September 2015
... the explanation of the surface free energy results. © Emerald Group Publishing Limited 2015 Shear strength Wetting Chip scale package (CSP) Ultrasonic bonding Oxygen followed by argon plasma treatments Surface characterization Wire bond Chip bond pad Light emitting diode Dispersive...
