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Keywords: Pad design
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Journal Articles
Design criteria for pad and stencil with high pick-and-Place yield
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (3): 145–152.
Published: 14 October 2021
...Chien-Yi Huang; Christopher Greene; Chao-Chieh Chan; Ping-Sen Wang Purpose This study aims to focus on the passive components of System in Package SiP modules and discusses the geometric pad designs for 01005-sized passive components, the front end design of the hole size and shape of the stencil...
