... power electronics due to its outstanding mechanical and thermal properties. Among the various sintering parameters, applied pressure plays a critical role in determining the porosity and, consequently, the mechanical performance of the resulting bond. Although the influence of sintering pressure has...

... is developed in this paper to incorporate the impact of sintering pressure on the steady-state creep rate, and its validity has been carefully evaluated. The findings suggest that using higher sintering pressures in the assembly of power electronic modules with sintered silver interconnects can enhance...

... compared with sintered Ag and sintered Cu, which both result in reduced stresses. Originality/value Power electronics exceptionally rely on ceramic-based and polymer-based substrate systems due to their superior thermal conductivity, heat resistance and electrical insulation properties. The strategic...

...Mohammad A. Gharaibeh; Jürgen Wilde Purpose In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical...

... are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads. Findings The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy...