...Ali Sezer; Aytaç Altan Purpose In the production processes of electronic devices, production activities are interrupted due to the problems caused by soldering defects during the assembly of surface-mounted elements on printed circuit boards (PCBs), and this leads to an increase in production...

...Jie Tang; Yi Gong; Zhen-Guo Yang Purpose The submitted paper is mainly concerned with the cracking of blind and buried vias of printed circuit board (PCB) for smartphones which were encountered with abnormal display problems like scramble display or no display during service and had to be recalled...

...Attila Geczy; Márta Fejos; László Tersztyánszky Purpose – This paper aims to reveal the causes and find an efficient method to compensate the shrinkage to reduce failure costs. Reflow-induced printed circuit board (PCB) shrinkage is inspected in automotive electronics production environment...

...Weisheng Xia; Ming Xiao; Yihao Chen; Fengshun Wu; Zhe Liu; Hongzhi Fu Purpose – The purpose of this paper is to study the thermal warpage of a plastic ball grid array (PBGA) mounted on a printed circuit board (PCB) during the reflow process. Design/methodology/approach – A thermal...

... © MCB UP Limited 1999 --> Internet Printed circuit board Publication Repair Free PC board repair guidebook available on the internet Keywords Internet, Printed circuit board,Publication, Repair Circuit Technology Center,Inc. has announced that its popular...

... circuit board (PCB) within a conventional PCB‐technology. Ball grid array Chip size package Printed circuit board Surface mount assembly The temperature profiles in IR systems show that the BGA is not the coldest device on the board. The leads of the QFPs and of the PLCCs/SOJs are 10...