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Keywords: Process optimization
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Journal Articles
Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–11.
Published: 26 May 2026
... of the packaging structure. Design/methodology/approach A multi-dimensional validation experimental scheme was designed: systematic and comprehensive research into the causes of wafer-level electroplating nodules and process optimization methods was conducted from three perspectives – root cause investigation...
