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Keywords: Prototypes
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Journal Articles
Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (1): 11–24.
Published: 06 February 2009
...Stoyan Stoyanov; Chris Bailey; Marc Desmulliez Purpose This paper aims to present an integrated optimisation‐modelling computational approach for virtual prototyping that helps design engineers to improve the reliability and performance of electronic components and systems through design...
