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Keywords: Quad-Flat no-Lead (QFN)
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 99–109.
Published: 03 April 2017
.... It is also recognized that the solder paste printing process is wholly responsible for the solder joint formation of leadless package technologies such as land grid array (LGA) and quad-flat no-lead (QFN) components and therefore is a determining factor in the long-term reliability of said devices. The aim...
