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Keywords: SLID bonding
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (2): 100–105.
Published: 08 February 2018
.... Originality/value Low-temperature solid-liquid interdiffusion (SLID) bonding is a novel technique, merging the fields of low-temperature solder bonding with the SLID/transient liquid phase (TLP) approach, which is normally used for much higher temperatures. The bonding process with 140 µm eutectic preform...
