...Ce Zeng; Yanming Zhang; Mingqi Gao; Can Sheng; Dongyang Lei; Yang Li; Yangyang Li; Zhenduo Cui; Shengli Zhu Purpose The thermo-mechanical properties of System-in-Package (SiP) products play a crucial role in manufacturability and reliability. The multi-material and cross-scale properties of SiP...

... of the core problems in system in package (SiP). It directly determined the application environment of SiP. In this paper, the authors built a data processing of SiP and a temperature measuring point was set up inside the chip, which could observe the maximum working temperature. The heat of SiP transferred...