... conducted on carriers made from silicon for bumping of die using solder paste. An anisotropic etching process was used to generate pockets in the silicon surface into which solder paste was printed. Die were then placed against the carrier and reflowed to transfer the solder directly to the bondpads...

... New lightweight, low thermal expansion silicon-aluminium alloys Keywords Osprey Metals, Silicone, Alloys A new range of Si/Al alloys containing up to 70%wt Si has been developed and commercialised by Osprey Metals (UK) using their patented, spray forming technology. The alloys...