...Barbara Dziurdzia; Janusz Mikolajek Purpose The purpose of this paper is to evaluate selected methods of reduction voidings in lead-free solder joints underneath thermal pads of light-emitting diodes (LEDs), using X-ray inspection and Six Sigma methodology. Design/methodology/approach...

... ; Liukkonen, 2003). Poor placement accuracy may be linked to poor component pickup conditions. The main purpose of this six sigma study was to find out the possible link between the pickup and placement accuracy of typical high‐speed components (this study concerns 0402 resistors and capacitors). Rotary...