Keywords: Sn‐based solder
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Journal Articles
Journal Articles
Soldering & Surface Mount Technology (2013) 25 (2): 76–90.
Published: 05 April 2013
... reviews the available reports on the electrodeposition of tin (Sn)‐based solder systems and identifies the challenges in this area. Findings Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected...

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