Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-3 of 3
Keywords: Sn-Cu
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (3): 175–188.
Published: 01 December 2022
... This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (1): 24–32.
Published: 16 January 2020
...Ashutosh Sharma; Byungmin Ahn Purpose The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from alkaline stannate baths. Design/methodology/approach Sn-Cu solder coatings were...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (4): 188–200.
Published: 05 September 2016
... into more detail, as well as field test. Flux Sn-Ag-Cu Solder Solder paste PEG-rosin Polyethylene glycol Rosin Sn-Cu Kanlaya Phaphon is the corresponding author and can be contacted at: Kanlaya.P@Student.chula.ac.th 27 08 2015 20 12 2015 25 05 2016 31 05 2016...
