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1-4 of 4
Keywords: Solder alloy
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Journal Articles
Zuraihana Bachok, Aizat Abas, Hooi Feng Tang, Muhammad Zaim Hanif Nazarudin, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (4): 219–229.
Published: 31 May 2024
...Zuraihana Bachok; Aizat Abas; Hooi Feng Tang; Muhammad Zaim Hanif Nazarudin; Mohamad Fikri Mohd Sharif; Fakhrozi Che Ani Purpose This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found...
Journal Articles
Vicente-Segundo Ruiz-Jacinto, Karina-Silvana Gutiérrez-Valverde, Abrahan-Pablo Aslla-Quispe, José-Manuel Burga-Falla, Aldo Alarcón-Sucasaca, Yersi-Luis Huamán-Romaní
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (2): 69–79.
Published: 28 September 2023
... be contacted at: yersiluis51@gmail.com 13 08 2023 02 09 2023 10 09 2023 11 09 2023 © Emerald Publishing Limited 2023 Emerald Publishing Limited Licensed re-use rights only Solder alloy Machine learning Fatigue lifetime Finite element modeling Over the past...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (4): 208–217.
Published: 04 May 2023
.... The Ag3Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (3): 175–188.
Published: 01 December 2022
...Asyraf Abdullah; Siti Rabiatull Aisha Idris Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study...
