...Yeqing Tao; Dongyan Ding; Ting Li; Jason Guo; Guoliang Fan Purpose This paper aims to study the influence of reflow atmosphere and placement accuracy on the solderability of 01005 capacitor/SAC305 solder joints. Design/methodology/approach The 01005 capacitors were mounted on OSP-coated pads...

...W. Liggett; K.‐W. Moon; C. Handwerker An experimental method for measurement system improvement is presented and applied to development of a protocol for solderability measurement with a wetting balance. Protocol development is central to development of reliable monitoring systems for manufacturing...

...P.T. Vianco; A.C. Claghorn ** A study was performed which investigated the wettability of 63Sn‐37Pb and 96.5Sn‐3.5Ag solders on copper and gold ‐nickel plated Kovar ™ using a rosin ‐based, mildly activated (RMA) flux, a water soluble organic acid flux (WS ),and a low residue (LR) flux...

...C. Hunt The development and characterisation of a prototype solderability reference standard based on a gold‐plated nickel sample has been described previously. This material has now been tested in an intercomparison with several European laboratories. The results presented here show that a high...