...Meng Xiao; Nian Cai; Zhuokun Mo; Shule Yan; Nili Tian; Jing Ma; Han Wang Purpose Statistical modeling has been successfully applied to integrated circuit (IC) solder joint inspection. However, there are some inherent problems in previous statistical modeling methods. This paper aims to propose...

... method for the AOI system based on to inspect integrated circuit (IC) solder joints defects. Design/methodology/approach In the proposed method, the locally statistically modeling stage and the globally ensemble learning stage are involved to tackle the inspection problem. At the former stage...