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Keywords: Strain
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Journal Articles
Microstructural Modelling and Electronic Interconnect Reliability*
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1997) 9 (2): 61–64.
Published: 01 December 1997
.... The effect of these features on the strain distributions within the joints is shown. These strain distributions can be used to predict fatigue lives. This is demonstrated for homogeneous solder joints for which excellent correlation was shown between predicted lives and those measured experimentally...
