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Keywords: Substrate
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Journal Articles
Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (5): 258–265.
Published: 08 March 2021
... that includes a selection of the cooling mode, design of heatsink/substrate and thermal interface material (TIM). Among the significant factors that increase the light output of the of the LED system are efficient substrate and TIM. In this work, the influence of TIM on the luminous flux performance...
Journal Articles
A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (1): 26–34.
Published: 04 January 2018
... was completed with the duration of 0, 24, 48, 72 and 96 h under direct current (DC) of 1,000 mA. Tensile stress on the substrates was assessed after EM at a tension rate of 0.1 mm/min. Microscopy was used to observe the formation and size of voids and conduct an analysis between copper and nickel substrates...
Journal Articles
Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1996) 8 (3): 12–18.
Published: 01 December 1996
...) and 39±4°(LR). For the gold ‐nickel plated Kovar™substrates, the 63Sn‐37Pb solder at 215° had contact angles of 15±3°, 35±6° and 29±6° for the RMA, WS and LR fluxes, respectively. The values were reduced at the higher test temperature(245°). The 96.5Sn‐3.5Ag solder also exhibited good wetting performance...
