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Keywords: Surface characterization
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Journal Articles
Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (4): 129–136.
Published: 07 September 2015
... were applied to LED chip bond pad prior to wire bonding process with different treatment durations. Various surface characterization methods and contact angle measurement were then used to characterize the surface properties of these chip bond pads. To validate the improvements of Ar, O2...
