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Keywords: System-in-package (SiP)
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–13.
Published: 01 May 2026
... are interconnected and controlled by the eight-channel CMOS master chip, forming a complete functional module. For the subsequent thermal analysis, the operational power dissipation is defined as 1.32 W for each GaAs chip and 2.0 W for the CMOS chip. System-in-package (SiP) Millimeter-wave (mmWave) Thermo...
