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Keywords: Techniques
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Journal Articles
Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (1): 11–24.
Published: 06 February 2009
... numerical techniques for computational modelling (finite element analysis) coupled with numerical methods for statistical analysis and optimisation. In this study, the integrated optimisation‐modelling design strategy is adopted to prototype virtually a fine‐pitch flip‐chip package at the solder...
