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1-5 of 5
Keywords: Temperature
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (3)
Published: 01 December 2001
... IPC-7530: the definitive guide for temperature profiling for mass soldering (reflow and wave) processes Keywords: Soldering, Temperature Dynamix Technology Ltd announces the release of IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... Keywords NPL, Electronics, Assembly, Temperature, Measurement, Monitoring The electronics industry world-wide has begun the move to eliminate lead from its manufacturing process. However, the increased wave and reflow soldering temperatures associated with the new alternative alloys means...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> ECD Instruments Temperature Reflow Wave soldering Keywords ECD Instruments, Temperature, Reflow, Wave soldering ECD has announced its new AutoM.O.L.E® temperature profiling system for reflow ovens and wave solder machines. When preloaded onto...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (1): 36–43.
Published: 01 April 1999
...Christopher Hunt; Ling Zou The surface insulation resistance (SIR) test has traditionally been performed by taking measurements at certain points during a seven‐day test under well established environmental conditions. The work reported here explores the influence of test temperature and humidity...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1998) 10 (1): 19–25.
Published: 01 April 1998
... or ingested. As researchers began to focus on Pb‐free solders, they recognized their value in high temperature applications (e.g. automotive manufacturing) where Sn/Pb solders do not meet the requirements. There are many factors to consider when developing lead‐free alloys: manufacturability, availability...
