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Keywords: Temperature profile
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Journal Articles
Buen Zhang, Noor H. Jabarullah, Ayad F. Alkaim, Svetlana Danshina, Irina V. Krasnopevtseva, Yuan Zheng, Nisith Geetha
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (3): 187–194.
Published: 16 November 2020
... devices Creep strain Strain energy density Temperature profile Fully accepting the fact that power semiconductors lead to more accelerated aging in power electronics systems, a significant number of recent reports have been made the point that solder thermo-mechanical fatigue is the vulnerable...
