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Keywords: Tensile behavior
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Journal Articles
Journal Articles
Soldering & Surface Mount Technology (2021) 33 (4): 197–205.
Published: 16 November 2020
..., c) SAC305 0.35%Ce, d) SAC305 0.55%Ce, e) SAC305 0.75%Ce, f) SAC305 0.95%) by wt Intermetallic compounds Microstructure Tensile behavior Cerium Tin-Silver-Copper Solder alloys are used to make electrical connections and provide support to the circuitry in electrical devices...

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