... to the printed circuit board (PCB) using electrically conductive adhesive, and its role was to supply electrical power to the samples. Figure 1 shows the structure of the samples. Thermography Thermal joints Silver nanoparticles Mechanical and thermal characterization Electronic packaging...

...Krzysztof Jakub Stojek; Jan Felba; Johann Nicolics; Dominik Wołczyński Purpose This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated...

... MCB UP Limited 1998 Infra‐red Reflow process recipe Sensors Thermography Successful reflow soldering of electronics assemblies involves operator skill, experience and time in process set up. Typical process recipe determination procedures require the use of sacrificial PCAs...