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Keywords: Thermomigration
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–16.
Published: 27 January 2026
... Publishing Limited Licensed re-use rights only Thermomigration Microbump joint Intermetallic compounds (IMCs) Sn grain orientation Reliability Anisotropy the Major Key Project of Pengcheng Laboratory PCL2025A04 the Key Project of Science and Technology of Changsha kq2102005...
