Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-2 of 2
Keywords: Thick film pastes
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Performance optimization of Ag/ATO thick film resistor pastes
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (3): 234–242.
Published: 27 February 2025
...-Chemical , Vol. 114 No. 1 , pp. 32 - 39 . Hlina , J. , Reboun , J. , Simonovsky , M. , Syrovy , T. , Janda , M. and Hamacek , A. (2022), “ Study of new Nitrogen-Fireable Copper-Nickel thick film paste formulation compatible with thick printed copper ”, Materials , Vol...
Journal Articles
Bonding of zero-shrink LTCC with alumina ceramics
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (4): 157–163.
Published: 07 September 2015
... process. We have used two methods for bonding the substrates: cold chemical lamination (CCL) and thermo compression method, using a dielectric thick-film paste as the adhesive. Optical microscopy, scanning electron microscopy and electric testing of the screen-printed patterns were used for verification...
