Keywords: Thin films
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Journal Articles
Soldering & Surface Mount Technology (2013) 25 (1): 15–23.
Published: 01 February 2013
...Liu Mei Lee; Habsah Haliman; Ahmad Azmin Mohamad Purpose The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various temperatures and times. Design/methodology/approach SAC305 thin...

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