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Keywords: Through lifetime monitoring
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 30–37.
Published: 03 February 2012
... distribution plot shows a normal distribution pattern, where corner joints have the lowest reliability and are more likely to fail first. A strong agreement between AMI monitoring test data and FE prediction was observed, demonstrating the feasibility of through lifetime monitoring of solder joints using AMI...
