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Keywords: Transfer efficiency (TE)
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 99–109.
Published: 03 April 2017
...) Transfer efficiency (TE) Organic solderability preservative (OSP) Successful solder paste printing is often the greatest challenge faced during a surface mount technology electronic assembly process. Industry reports that 51-71 per cent of fine and ultra-fine pitch defects occur because...
