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Keywords: Transient thermal warpage
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (4): 231–243.
Published: 31 May 2023
... and possible methods to suppress crack formation. Findings Hot tear cracks existed in Sn–Bi solders with different bismuth (Bi) contents, but increasing the solder volume reduced the number of hot tear cracks. Experiments were designed to test the degree of chip transient thermal warpage with temperature...
