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Keywords: Underfill process
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (2): 128–138.
Published: 08 October 2020
... are closely surrounded and protected by the underfill to improve joint strength and resist external force factors, such as collision and vibration. This paper addresses the defects caused during the second reflow process of a vehicle electronic communication module after the underfilling process. Figure 4...
