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Keywords: Void
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (2): 117–127.
Published: 05 April 2013
...Chien‐Yi Huang; Yueh‐Hsun Lin Purpose The purpose of this paper is to employ data mining as a new diagnosing scheme for investigating void formation to the thermal pad in quad flat non‐lead (QFN) assembly. Occurrences of voiding in various scenarios of component design, materials selection...
