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Keywords: Volume measurement
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Journal Articles
X‐ray solder alloy volume measurement (XSVM) in pin‐in‐paste technology (PIP)
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 26–40.
Published: 09 February 2010
... simplified to line fitting. © Emerald Group Publishing Limited 2010 X‐rays Solder Alloys Volume measurement Solder paste Today, the use of “multi‐named” pin‐in‐paste (PIP) (or alternative assembly and reflow technology, intrusive reflow, pin‐in‐hole reflow, paste‐in‐hole printing, etc...
