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Keywords: Wafer-level package (WLP)
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (3): 178–186.
Published: 02 November 2020
...Haiyan Sun; Bo Gao; Jicong Zhao Purpose This study aims to investigate the several parameters in wafer-level packaging (WLP) to find the most critical factor impacting the thermal fatigue life, such as the height of copper post, the height of solder bump, the thickness of chip. The FEA results...
