...Jie Wu; Guangyao Chen; Shujia Fan; Ruiyang Pang; Yu Liang; Yi Teng Purpose This study aims to minimize the warpage issue in memory-computing integrated chiplets with 2.5D packaging on a large-scale wafer subjected to multistress through synergistic optimization of key structure paraeters...

...Liming Chen; Enying Li; Hu Wang Purpose Reflow soldering process is an important step of the surface mount technology. The purpose of this paper is to minimize the maximum warpage of shielding frame by controlling reflow soldering control parameters. Design/methodology/approach Compared...

... material is processed at the maximum temperature of 200°C, which can mean that the material may undergo additional post-curing at excessive reflow temperatures. Automotive Reflow soldering Glass fibre-reinforced epoxy composite Printed circuit board Shrinkage Warpage With the increasing...

...Miky Lee Considers a process for better mechanical design of printed circuit boards (PCBs) which suffer from warpage during the assembly process. During the reflow process, PCBs experience a wide range of temperatures, i.e. from ambient temperature to the peak temperature reached in the furnace...