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Keywords: Wetting balance method
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Journal Articles
Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (1): 21–26.
Published: 01 April 1999
... Flip chip Flux Surface insulation resistance Wetting balance method The endless demand for space‐saving in portable electronics forces companies to find smaller packages for components. A very promising technology in this progress is direct chip attachment (DCA) or flip chip (FC). In FC...
