Keywords: Nanoparticles
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World Journal of Engineering (2013) 10 (2): 113–118.
Published: 01 June 2013
...Y. Kobayashi; S. Ishida; K. Ihara; Y. Yasuda; T. Morita This work describes a metal-metal bonding process by the use of Cu nanoparticles as a filler material. The Cu particles used were prepared by reduction of Cu2+ with hydrazine in the presence of cetyltrimethylammonium bromide...
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