Real‐time control of advanced solderability preservatives

Organic and immersion metallic coatings are being used as a replacement for the hot air solder level (HASL) process. Use of these coatings provides advantages for both the fabricator and assembler. Advantages to assemblers include flatter pads (0.25‐0.5 micron thickness), no limitations on fine pitch or small hole cleaning, and greater solder joint strength. Advantages to the fabricator include lower operating costs, little or no rejects/rework, reduced safety hazard and a more environmentally friendly process. Current problems associated with the organic and immersion coatings include the inability to assess the solderability of the bare copper or the integrity of the coating (organic). These coatings also present a critical concern due to their reduced shelf life and potential inability to survive mishandling in manufacturing. Real time, non‐destructive methods of rapidly assessing the integrity these coatings are currently not available to the electronics industry. Surface Spectroscopy measurement techniques have the potential to measure the structure and characteristics of the organic and metallic coatings, and surface oxides that develop with time and temperature. The measurement techniques are rapid, non‐contact, and relatively inexpensive to make when compared to existing methods. Surface Spectroscopy can also provide critical surface information that is needed to troubleshoot solderability problems. The American Competitiveness Institute in association with the Navy EMPF program is working with several industry partners to develop a usable surface spectroscopy tool that will assess the quality and integrity of the coatings and correlate that reading with a solderability evaluation.