The purpose of this paper is to describe in detail the direct metallization of printed wiring boards using ENVISION® HDI for the selective formation of intrinsic conductive polymer.
The process technology offers several advantages over the most commonly used electroless copper process: including higher through‐put; no deposition on metallic surfaces eliminating needs for post‐treatment in a micro‐etch, few process steps; significant reductions in water consumption and waste water, which does not contain hazardeous components such as metal, chelators and formaldehyde.
ENVISION HDI consists of only three process modules (conditioner, initiator and catalyst), each controlled by standard analytical technologies. In addition the quality out‐put of each module is monitored using a second set of standardized procedures, ensuring total process management, hence documenting complete process reliability.
This paper describes in detail quality control approaches for each process segment to provide a high level of performance and quality assurance for the process as a whole.
