Issues

Book reviews

Handbook of Thick Film Technology – 2nd edition

Brian Ellis
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Handbook of Thick Film Technology – 2nd edition

Martin Goosey
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Halogen‐free laminates: worldwide trends, driving forces and current status

Jérôme De Boysère; Adrian Beard
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Integrated waveguides for optical interconnects

Denis Sweatman; Olly Powell; Shinoj Francis
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Occupational exposure and environmental emissions related to nickel plating: a sample of the UK nickel plating sector

Wouter Ghyoot; Rebecca Green; Bryan Fisher
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Stress analysis for fracturing potential of blind via in a build‐up substrate

Tong Hong Wang; Yi‐Shao Lai
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De‐mystifying materials selection for lead‐free soldering

Casper Chen; Joshua Chiang; F.Y. Lee
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Evolution of a wiring concept – 30 years of flex‐rigid circuit board production

Markus Wille
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Dual metal core multilayer boards (MLBS) – a better option for high speed spacecraft electronic packaging applications

C. Hanumanth Rao; Jissy Varghese; A. Suresh; B.N. Baliga
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Company profile

Merlin Circuit Technology Limited Kestrel International Circuits

John Ling
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Exhibitions and conferences

Productronica 2005

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World electronics forum

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ICT Symposium: “Microwave Technology”, Arundel, 28 September 2005

Pete Starkey
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The board authority live – the impact of green technology, 4 October 2005

Martin Goosey
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Industry news

PROSURF – a project for the promotion and support of SME research and innovation

Ian Dalrymple
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International diary

International diary

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Internet commentary

Internet commentary

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Reports

“Catch me if you can”

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Innovative electronics Manufacturing Research Centre (IeMRC)

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