Issues

Appointments

Daleba appoints new CEO

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Gary R. Sutcliffe Promoted to Manager, Corporate Technical Services – Enthone Americas

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GSPK Design expands electronic design team

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Arthur Huenecke joins IPC as chief information officer

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Low‐power noise multilayer PCB with discrete decoupling capacitors inside

Ki‐Jae Song; Jongmin Kim; Jongwoon Yoo; Wansoo Nah; Jaeil Lee; Hyunseop Sim
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A multilayer process for the connection of fine‐pitch‐devices on molded interconnect devices (MIDs)

Thomas Leneke; Soeren Hirsch; Bertram Schmidt
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Cracking phenomena on flexible‐rigid interfaces in PCBs under thermo cycling loading

Luciano Arruda; Renato Bonadiman; Josineto Costa; Tommi Reinikainen
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A direct‐writing approach to the micro‐patterning of copper onto polyimide

J.H.‐G. Ng; M.P.Y. Desmulliez; M. Lamponi; B.G. Moffat; A. McCarthy; H. Suyal; A.C. Walker; K.A. Prior; D.P. Hand
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Reflow ageing influences and wettability effects of immersion tin final finishes with lead‐free solder

Thomas Hetschel; Klaus‐Jürgen Wolter; Fritz Phillipp
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Conferences and exhibitions

iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport

Martin Goosey
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Technology breakthroughs – bending the design rules

Peter Starkey
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EIPC Winter Conference Review – Amsterdam, 12-13 February 2009

Pete Starkey
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EPTC 2008 – Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne Waterfront Hotel, Singapore

Martin Goosey
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Electronica 2008

John Ling
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Industry news

Researchers recycle circuit boards as road paving material

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IPC issues updated world PCB production and laminate market report

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UK researchers explore using laser technology as a low-cost, chemical-free method of making PCBs

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Artetch achieves Green Belt in quality training

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HannStar Board expected to take a 50-70 per cent global share of netbook PCB market in 2009

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SOMACIS GRAPHIC announces TUV ISO/TS 16949 awarded to Dongguan Somacis Graphic

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Selection of DEK Horizon 03i underpins DCI quality commitment

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RUWEL offers masslam production as a service

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Camtek reports additional cost-reduction measures, cuts 14 per cent of worldwide work force or 68 employees

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AT&S moves Klagenfurt plant to short-time working

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New products

Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish

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