Issues

Book review

Nanopackaging: Nanotechnologies and Electronics Packaging

Martin Goosey
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EnFACE: a maskless process for circuit fabrication

Sudipta Roy
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Halogen‐free materials with improved thermal and electrical properties

David Bedner; Michael He
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Influences on the reflow soldering process by components with specific thermal properties

Florian Schüßler; Denis Kozic; Jörg Franke
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The processing time optimization of printed circuit board

Mircea Ancău
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Microfluidic systems on a printed wiring board platform

Keryn Lian; Shawn O'Rourke; Daniel Sadler; Claudia Gamboa; Robert Terbrueggen; Marc Chason
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Method and system of automated measurement of micro drill bit wear

Lianyu Fu; Jian Li; Fan Yang
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Exhibitions and conferences

SMT/HYBRID/PACKAGING, Nürnberg, Germany, 5-7 May 2009

John Ling
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SMART Group seminar on printed circuit materials and finishes

Pete Starkey
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Printed Electronics Europe,7-8 April 2009,Dresden, Germany

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Industry news

Prism builds on long-standing contract to help develop low energy lighting

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European PCB industry

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ISO 9001:2000 success for GSPK Design

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New appointments

CC Electronics continues to grow with new appointment

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New products

Intertronics and Turbo-Coat – tack free in three minutes

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Helmut Fischer Institute developed new X-ray technique for coating thickness analysis

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