Issues

Appointments

AT&S Austria appoints new chairman

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Park Electrochemical appointed Jean-Francois Le Rouzic to Director of Marketing and Sales of all the Corporation’s product lines in Europe and Mark Carlson to Director of Global RF Marketing

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Printing technology for ubiquitous electronics

Jayna R. Sheats; David Biesty; Julien Noel; Gary N. Taylor
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Chemical “kick start” for the autocatalytic formaldehyde‐free electroless copper plating process

Edith Steinhäuser; Lutz Stamp; Lutz Brandt
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New lifecycle monitoring system for electronic manufacturing with embedded wireless components

Axel Bindel; Paul Conway; Laura Justham; Andrew West
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Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging

Rabindra N. Das; Frank D. Egitto; Voya R. Markovich
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Integrated optical and electronic interconnect PCB manufacturing research

David R. Selviah; Andy C. Walker; David A. Hutt; Kai Wang; Aongus McCarthy; F. Anibal Fernández; Ioannis Papakonstantinou; Hadi Baghsiahi; Himanshu Suyal; Mohammad Taghizadeh; Paul Conway; John Chappell; Shefiu S. Zakariyah; Dave Milward; Richard Pitwon; Ken Hopkins; Malcolm Muggeridge; Jeremy Rygate; Jonathan Calver; Witold Kandulski; David J. Deshazer; Karen Hueston; David J. Ives; Robert Ferguson; Subrena Harris; Gary Hinde; Martin Cole; Henry White; Navin Suyal; Habib ur Rehman; Chris Bryson
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Editorial

Editorial

Martin Goosey
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Exhibitions and conferences

EIPC-IONMET Workshop: Ionic Liquid Plating Technologies in Development. Silver and Gold Final Finishes for PCBs

Pete Starkey
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Good quality and high reliability are not an accident!

Pete Starkey
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Packaging and Interconnection for Electronics and Sensors – Past, Present and Future. A seminar to mark the retirement of David Pedder

Martin Goosey
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Institute of Circuit Technology High Performance Laminates Seminar

Richard Wood-Roe
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EIPC-EBFRIP Seminar,

J.H. Ling
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IeMRC – CAFMAD Workshop on Novel Electronic Materials

Martin Goosey
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EIPC Winter Conference

J.H. Ling
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Industry news

AT&S and Solland Solar to build prototype production line for photovoltaic modules with Sunweb® back-contacted solar cells

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EIPC announce new IEC Standards for the PCB industry

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Graphic plc to save operational costs with Orbotech Sprint-8 inkjet legend printer

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New HASL line for Sulakshana Circuits, India

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New CEMCO immersion silver line for Thales Netherlands

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Capacity for preparation of advanced electronic devices

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UK electronics manufacturers industry – what is in store for 2010?

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Aspocomp Oulu expands laser direct imaging capabilities with Orbotech’s New ParagonTM-SM 20

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Wrekin Circuits Limited: a profile

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Invotec awarded AS9100

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International diary

International diary

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New products

Polar adds Speedflex flex-rigid PCB capability to the Speedstack layer stackup design system

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