...Sony Mathew; Michael Osterman; Michael Pecht; Frank Dunlevey Purpose The purpose of this paper is to present the results from work on a project aimed at evaluating six different copper alloy substrates coated with pure tin for tin whisker growth. The influence of intermetallic growth between...

... dispersive spectroscopy (EDS). Findings The ECM resistance of the conventional Sn‐37Pb alloy was lower than that of the Pb‐free Sn‐3.0Ag‐0.5Cu alloy. The dendrites grew at the cathode electrodes on the PCB and expanded to the anode electrode. The main elements in the dendrites on the Sn‐37Pb and Sn‐3.0Ag...

... and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection. © Emerald Group Publishing Limited 2005 Soldering Alloys Coating processes The electroless nickel plating process used in this work was developed for the UBM of flip chip wafer...

... for considerably longer duration. Figure 1 Figure 2 Schematic showing that increasing etch depth reduces whiskering Semiconductors Alloys Electrodeposition With the date for the introduction of legislation (RHS Directive, 2003 ; WEEE Directive, 2003) requiring lead...

...Paul Casey; Michael Pecht This paper presents the analysis of information collected from numerous patent searches on lead‐free alloys. The significance of claim structure and content is discussed in view of the growing number of lead‐free patents. Patent analysis software was developed...