..., and thus the lack of essential electrons for the copper deposition. © Authors 2010 Additives Acids Copper Organic compounds Coating processes Additional electrons are delivered by exploitation of the catalytic qualities of palladium. The electrons develop during the oxidation...

... interface etching is observed; that does not require the use of strong inorganic acids or expensive catalysts to sustain deposition and which does not appear to be light sensitive in contrast to other processes. © Emerald Group Publishing Limited 2010 Silver Surface treatment Coating processes...

... deposits having a unique combination of properties and with production‐proven capability to be an ideal lead‐free solution as a solderable finish for electronic components. Soldering Semiconductors Coating processes Ductility The results obtained with the tin‐lead solder are shown in Figure 9...

... and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection. © Emerald Group Publishing Limited 2005 Soldering Alloys Coating processes The electroless nickel plating process used in this work was developed for the UBM of flip chip wafer...